While the Samsung Galaxy S3 hasn’t been on the market that terribly long, that doesn’t stop the world from thinking about what’s just around the corner. Just a few months after the Galaxy S3 was released and became popular, rumors began to surface about the next-generation Galaxy S. In Samsung’s words, “the next big thing is already here coming”.

Rumors currently give the Galaxy S4 an April 2013 release date and an introduction sometime before then at CES and/or Mobile World Congress. Some agree that this seems strange for Samsung though, as generally they like to conduct their own special events for massive announcements like that of a new flagship phone.

As far as hardware is concerned, the Galaxy S4 is rumored to have a quad-core processor that is more powerful than the S3′s, a 13 MP camera, and a full HD 441 ppi display.

Samsung is looking to get themselves back on top in terms of displays after HTC and Sharp stole the spotlight with full HD displays. Furthermore, UBS’s Nicolas Gaudois claims that ”preparations for volume manufacturing of unbreakable plastic substrate displays continue. All in all, we could see a strong products push in the high-end in the first half, followed by other releases.”

It has also been said that Samsung is working hard on flexible displays. A combination of flexible and unbreakable displays would create a completely new generation of smartphones and tablets.

Are you looking forward to having an unbreakable/flexible display? Which one would you want to have on your phone more? Let us know in the comments below.

[ Source ]

The post Rumor: Samsung Galaxy S4 to Land in April 2013 With An Unbelievable Display appeared first on Mobile Magazine.

While HTC has plans to release their newly unveiled S4 powered One S (T-Mobile) and One X (AT&T version) within the next two months, Microsoft is reportedly busy testing a Windows Phone 8 smartphone, which is intended for Sprint’s network, with the dual-core 1.5GHz Qualcomm MSM8960 chipset. The new info comes to us courtesy of the folks over at The Verge who were apparently tipped off by “sources familiar with the company’s plans”.

According to The Verge, at least one Windows Phone 8 handset will arrive later this year and the company is hoping that their device will exhibit impressive performance with the chip onboard as the S4 has been proven to be better than Samsung’s Galaxy S II (Exynos) and Motorola’s Droid 4 (TI OMAP) via many tests.

Reportedly, Sprint is interested in a Windows Phone 8 handset equipped with the chip and won’t be launching any new Windows phones before the introduction of WP8. The carrier has also contacted Nokia for sharing their LTE specifications.

But it is not known whether Microsoft will be checking out the quad-core Tegra 3 processor on the global version of the HTC One X. Although Qualcomm’s Snapdragon S4 has done remarkably well on previous tests, the latest benchmarks of the HTC One series show that the Tegra 3 is on par with S4 in processing power, and it actually is better when it comes to graphics performance.

The idea of multi-core processor support for future Windows Phones can never be pushed aside after this leak. And Qualcomm, when asked about the possibility of Windows Phone S4 devices, gave out answers that suggest they know about Microsoft’s tests.

We will keep you updated on the matter, so stay tuned.

The post Windows Phone 8 Dual-Core Smartphone For Sprint Being Tested? appeared first on Mobile Magazine.

The new module is a combo chip that’ll do the new Wi-Fi thing, as well as Bluetooth and FM radio. Even though 802.11ac sounds like it’s going backwards toward 802.11a/b/g, it’s actually quite a step ahead of 802.11n. Yeah, they should have picked another name, but the crux of it is that you get speeds of up to 433Mbps. That’s blazing, getting some people to call it 5G. It’s up to you if you agree.

Either way, the WCN3680 will work in tandem with the Snapdragon S4 MSM8960 and S4 APQ8064 dual-core and quad-core chips, which already support 802.11b/g/n Wi-Fi, as well as 3G/4G/LTE. Sample chips are being prepared for manufacturers for Q2, so hopefully we’ll see something with these modules in place by the end of the year.

The post Qualcomm WCN3680 Combo Chip Offers “5G” Connectivity appeared first on Mobile Magazine.