Intel discusses astonishing 3G plans
Intel President and COO Paul Otellini today outlined Intel’s plans for the growing wireless silicon market, focusing on the co-existence of broadband wireless technologies and the impact of Moore’s Law on the cellular and handheld market segments. Otellini was speaking at the 3GSM World Congress 2004, the wireless industry’s largest annual event.
“The wireless industry is evolving from a web of independent networks into a single, integrated wireless network with multiple standards, and no single standard is sufficient anymore, Otellini said. “There won’t be a battle of competing technologies. It will be a requirement that Wi-Fi, WiMAX, and 3G coexist; and that coexistence is going to enable a host of exciting new applications and business models.”
At 3GSM Intel also disclosed details of its next generation cellular and baseband processors, including a dual mode UMTS/wide-band CDMA (WCDMA) solution with an advanced receiver architecture that helps maintain higher quality signals and fewer dropped calls for phones operating on 3G networks. The upcoming family of processors, code-named Hermon, also features full videoconferencing capability.
Intel is developing standardized, high-performance silicon to address all of the multiple broadband wireless technologies, as well as a range of products for modular communications networks that will be crucial in the deployment of broadband wireless. It will begin shipping its first WiMAX chips later this year.
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