Fujitsu Microelectronics Asia Pte Ltd (FMAL) today introduced its first solid-state fingerprint-sensor product designed for embedded mobile computing systems and physical-access authentication systems. The new MBF110 fingerprint sensor features a 300 x 300 pixel sensor array that produces clear 500 DPI resolution fingerprint images. The sensor area is approximately 1.5cm square, which allows single -touch fingerprint authentication for all users. The sensor also features an ultra-hard patented scratchproof protective coating, an integrated 8-bit flash A/D converter and an 8-bit microprocessor interface. Sensor operating voltage range is from 3.3V to 5V. The product features very low operating and standby power consumption of 170 milliWatts and 250 microWatts, respectively.
The MBF110 fingerprint sensor is being fabricated using Fujitsu’s standard CMOS technology. It is available in two package configurations, an 80-pin LQFP package and an 80-pin VSPA package. The LQFP package offers an industry standard QFP footprint, and a thin 1.4mm profile, suitable for easy integration into laptop computers and other mobile PDA devices. The VSPA version consists of an integrated stainless steel ESD (electrostatic discharge) ground ring to provide exceptional tolerance to ESD events, and ultra-stiff package pins that result in a rugged sensor package suitable for heavy-use outdoor access or automotive applications.
The MBF110 is pin-to-pin compatible with the Veridicom FPS110 fingerprint sensor.